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Fiber Optics
Small Form Factor Single Mode 1300 nm 1.0625 Gbit/s Fibre Channel 1.25 Gigabit Ethernet Transceiver 2x5/2x10 Pinning with LCTM Connector
Preliminary Data Features * Small Form Factor transceiver * Complies with Fibre Channel and Gigabit Ethernet standards * RJ-45 style LCTM connector system * Available with or without collar * Half the size of SC Duplex 1x9 transceiver * Single power supply (3.3 V) * Low power consumption, 650 mW typical * Loss of optical signal indicator * Laser disable input * LVPECL differential inputs and outputs * AC/AC coupling in accordance to SFF MSA or optional DC/DC coupling version * For distance of up to 10 km on single mode fiber (SMF) * Class 1 FDA and IEC laser safety compliant * Multisource 2x5/2x10 footprint1) * Small size for high port density * UL 94 V-0 certified * Compliant with FCC (Class B) and EN 55022 * Tx and Rx power monitor on 2x10 pinning version
V23818-K15-Lxx
File: 1119
File: 1120
1)
Current MSA documentation can be found at www.infineon.com/fiberoptics
For ordering information see next page. LCTM is a trademark of Lucent.
Data Sheet
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Ordering Information Ordering Information Part Number V23818-K15-L37 V23818-K15-L36 V23818-K15-L47 V23818-K15-L46 V23818-K15-L17 V23818-K15-L16 V23818-K15-L57 V23818-K15-L56 V23818-K15-L35 V23818-K15-L45 2x5 2x10 Pinning Temperature Range 2x5 0C to 70C -40C to 85C 0C to 70C -40C to 85C 0C to 70C -40C to 85C 0C to 70C -40C to 85C 0C to 70C LVPECL no LVTTL DC AC DC AC LVTTL AC AC LVPECL DC DC LVTTL AC AC Signal Detect Collar Input DC Output DC
LVPECL yes
Data Sheet
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Pin Configuration Pin Configuration
HL HL 20 19 18 17 16 15 14 13 12 11
Tx
MS
TOP VIEW Rx MS
HL 1 2 3 4 5 6 7 8 9 10 HL
File: 1335
Figure 1
2x10 Pin Connect Diagram
2x10 Pin Description Pin No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 MS HL
1)
Symbol PDBias
Level/Logic DC current Ground Ground
Description PIN photo detector bias current Receiver signal ground Receiver signal ground Not connected Not connected Receiver signal ground Receiver power supply Receiver optical input level monitor Receiver data out bar Receiver data out Transmitter power supply Transmitter signal ground Transmitter disable Transmitter data in Transmitter data in bar Transmitter signal ground Laser diode bias current monitor Laser diode bias current monitor Laser diode optical power monitor Laser diode optical power monitor Mounting studs Housing leads
VEEr VEEr
NC NC
VEEr VCCr
SD RD- RD+
VCCt VEEt
TDis TD+ TD-
VEEt
BMon- BMon+ PMon- PMon+
Ground Power supply LVTTL or LVPECL output1) LVPECL output LVPECL output Power supply Ground LVTTL input LVPECL input LVPECL input Ground DC voltage DC voltage DC voltage DC voltage
LVPECL output active high for V23818-K15-L17/L16. LVTTL output active high for V23818-K15-L57/L56.
Data Sheet
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Pin Configuration
Tx
MS
HL HL 10 9 8 7 6
TOP VIEW Rx MS
HL 12345 HL
File: 1331
Figure 2
2x5 Pin Connect Diagram
2x5 Pin Description Pin No. 1 2 3 4 5 6 7 8 9 10 MS HL
1)
Symbol
Level/Logic Ground Power supply LVTTL or LVPECL output1) LVPECL output LVPECL output Power supply Ground LVTTL input LVPECL input LVPECL input
Description Receiver signal ground Receiver power supply Receiver optical input level monitor Receiver data out bar Receiver data out Transmitter power supply Transmitter signal ground Transmitter disable Transmitter data in Transmitter data in bar Mounting studs Housing leads
VEEr VCCr
SD RD- RD+
VCCt VEEt
TDis TD+ TD-
LVPECL output active high for V23818-K15-L37/L36/L35. LVTTL output active high for V23818-K15-L47/L46/L45.
VEEr / VEEt
For 2x10 transceivers, connect pins 2, 3, 6, 12 and 16 to signal ground. For 2x5 transceivers, connect pins 1 and 7 to signal ground.
Data Sheet
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Pin Configuration
VCCr / VCCt
For 2x10 transceivers a 3.3 V DC power supply must be applied at pins 7 and 11. For 2x5 transceivers a 3.3 V DC power supply must be applied at pins 2 and 6. A recommended power supply filter network is given in the termination scheme. Locate power supply filtering directly at the transceiver power supply pins. Proper power supply filtering is essential for good EMI performance. TD+ / TD- Transmitter data LVPECL level inputs. For V23818-K15-L47/L46/L57/L56/L45 terminated and AC coupled internally. For V23818-K15-L37/L36/L17/L16/L35 use termination and coupling as shown in the termination scheme. RD- / RD+ Receiver data LVPECL level outputs. For V23818-K15-L47/L46/L57/L56/L45 biased and AC coupled internally. For V23818-K15-L37/L36/L17/L16/L35 use termination and coupling as shown in the termination scheme. TDis A logical LVTTL high input will disable the laser. To enable the laser, an LVTTL low input must be applied. Leave pin unconnected if feature not required. SD LVTTL output for V23818-K15-L47/L46/L57/L56/L45. LVPECL output for V23818-K15-L37/L36/L17/L16/L35. A logical high output indicates normal optical input levels to the receiver. Low optical input levels at the receiver result in a low output. Signal Detect can be used to determine a definite optical link failure; break in fiber, unplugging of a connector, faulty laser source. However it is not a detection of a bad link due to data-related errors. MS Mounting studs are provided for transceiver mechanical attachment to the circuit board. They also provide an optional connection of the transceiver to the equipment chassis ground. The holes in the circuit board must be tied to chassis ground. HL Housing leads are provided for additional signal grounding. The holes in the circuit board must be included and tied to signal ground.
Data Sheet
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Pin Configuration 2x10 Transceiver Additional Functionality PDBias Connect pin 1 to VCC through a bias resistor, of a value not exceeding 2 k, as shown in Figure 3 to monitor PIN photo detector bias current. Leave pin floating if not used. Typical behaviour is shown in Figure 4 and Figure 5 using a 2 k load.
VCC
2 k Pin 1
Vbias
File: 1307
Figure 3
Photo Detector Bias Interface
Data Sheet
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Pin Configuration Typical Responsitivity of PIN Photo Detector Bias Current Monitor
400 Photo Detector Monitor Current (A)
300
200
100
0 0 100 200 300 400 Received Optical Power (W)
File: 1308
Figure 4
Linear Response
400
Photo Detector Monitor Current (A)
300
200
100
0 -30 -24 -18 -12 -6 0 Received Optical Power (dBm)
File: 1309
Figure 5
Logarithmic Response
Data Sheet
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Pin Configuration BMon- / BMon+ The DC voltage measured across pins 17 and 18 is proportional to the laser bias current. Use the equation:
Ibias = Vbias /10
Use this output to monitor laser performance and EOL conditions. A schematic and typical behaviour are shown in Figure 6 and Figure 7. Ibias @ ambient 25C < 60 mA. Leave pins floating if function is not required.
VCC
Pin 18 3 k 10 Pin 17 3 k
VEE
File: 1310
Figure 6
Bias Monitor - Transceiver Internal
0.36 0.32
BMon Output Voltage (V)
0.28 0.24 0.2 0.16 0.12 0.08 0.04 0 0 10 20 30 40 50 60 70
File: 1312
Temperature (C)
Figure 7
Data Sheet
Typical Variations of Bias Monitor Voltage over Temperature
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Pin Configuration PMon- / PMon+ This output is derived from the Tx monitor diode. Output voltage is in the range of 1.2 0.2 V. Source resistance RS = 100 k. Note: This voltage level is not MSA compliant.
Data Sheet
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Description Description The Infineon single mode transceiver is based on and compliant to the Physical Medium Depend (PMD) sublayer and baseband medium, type 1000-Base-LX (long wavelength) as specified in IEEE Std 802.3 and Fibre Channel FC-PI Rev. 13 100-SM-LC-L. The appropriate fiber optic cable is 9 m single mode fiber with LC connector. The Infineon single mode transceiver is a single unit comprised of a transmitter, a receiver, and an LC receptacle. This design frees the customer from many alignment and PC board layout concerns. This transceiver supports the LC connectorization concept, which competes with UTP/ CAT 5 solutions. It is compatible with RJ-45 style backpanels for fiber-to-the-desktop applications while providing the advantages of fiber optic technology. The receptacle accepts the new LC connector. The Small Form Factor is specially developed for distances of up to 10 km. The module is designed for low cost LAN and WAN applications. It can be used as the network end device interface in mainframes, workstations, servers, and storage devices, and in a broad range of network devices such as bridges, routers, hubs, and local and wide area switches. This transceiver operates at 1.0625 and 1.25 Gbit/s from a single power supply. The full differential data inputs and outputs are LVPECL compatible. Functional Description of SFF Transceiver This transceiver is designed to transmit serial data via single mode fiber.
BMonBMon+ Automatic Shut-Down TDis 3k TDTD+ Laser Driver Power Control PMonPMon+ RDRD+ SD PDBias Receiver 3k 10 3k
e/o
Tx Coupling Unit Laser
o/e
200 3k
Monitor Rx Coupling Unit
o/e
Single Mode Fiber
File: 1357
Figure 8
Data Sheet
Functional Diagram 2x10 Pin Rows
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Description
Automatic Shut-Down TDis TD- TD+ Laser Driver Power Control
Tx Coupling Unit
e/o
Laser
o/e
Monitor Rx Coupling Unit
Single Mode Fiber
RD- RD+ SD
Limiting Amp
TIA
o/e
File: 1351
Figure 9
Functional Diagram 2x5 Pin Rows
The receiver component converts the optical serial data into an electrical data (RD+ and RD-). The Signal Detect output (SD) shows whether an optical signal is present. The transmitter part converts electrical LVPECL compatible serial data (TD+ and TD-) into optical serial data. The module has an integrated shutdown function that switches the laser off in the event of an internal failure. Reset is only possible if the power is turned off, and then on again. (VCCt switched below VTH). The transmitter contains a laser driver circuit that drives the modulation and bias current of the laser diode. The currents are controlled by a power control circuit to guarantee constant output power of the laser over temperature and aging. The power control uses the output of the monitor PIN diode (mechanically built into the laser coupling unit) as a controlling signal, to prevent the laser power from exceeding the operating limits.
Data Sheet
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Description Regulatory Compliance Feature Standard Comments Class 1C ESD: EIA/JESD22-A114-B Electrostatic Discharge to (MIL-STD 883D the Electrical Pins Method 3015.7) Immunity: Against Electrostatic Discharge (ESD) to the Duplex LC Receptacle EN 61000-4-2 IEC 61000-4-2
Discharges ranging from 2 kV to 15 kV on the receptacle cause no damage to transceiver (under recommended conditions). With a field strength of 3 V/m, noise frequency ranges from 10 MHz to 2 GHz. No effect on transceiver performance between the specification limits.
Immunity: EN 61000-4-3 Against Radio Frequency IEC 61000-4-3 Electromagnetic Field
Emission: Electromagnetic Interference (EMI)
FCC 47 CFR Part 15, Noise frequency range: Class B 30 MHz to 18 GHz EN 55022 Class B CISPR 22
(13.97) *) .550
*) min. pitch between SFF transceiver according to MSA.
Dimensions in (mm) inches
File: 1501
Figure 10
Transceiver Pitch
Data Sheet
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Technical Data Technical Data Absolute Maximum Ratings Parameter Package Power Dissipation Supply Voltage Data Input Levels Differential Data Input Voltage Swing Storage Ambient Temperature Hand Lead Soldering Temp/Time Wave Soldering Temp/Time Aqueous Wash Pressure Symbol Limit Values min. max. 0.95 W V V V C C/s C/s psi 4 Unit
VCC-VEE VCC+0.5 VIDpk-pk
-40
VEE-0.5
5 85 260/10 260/10 < 110
Exceeding any one of these values may destroy the device immediately.
Data Sheet
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Technical Data Recommended Operating Conditions Parameter Ambient Temperature Ambient Temperature Transmitter Data Input High Voltage DC/DC VIH-VCC Differential Data Input Voltage Swing AC/AC Data Input Low Voltage DC/DC Data Input Rise/Fall Time Supply Current Tx Receiver Input Center Wavelength Supply Current Rx
1) 2) 3)
Symbol min.
1), 3) 2), 3)
Limit Values typ. max. 85 70 3.3 3.46 -880 3200 -1475 120 140 1260 1580 130 -40 0 3.14 -1165 500 -1810
Unit C V mV mV mV ps mA nm mA
TAMB VCC-VEE
Power Supply Voltage
VIDpk-pk VIL-VCC ti ICCt
Rx
ICCr
For V23818-K15-L36/L46/L16/L56. For V23818-K15-L37/L47/L17/L57/L35/L45. Ambient operating temperature requires a 2 ms-1 airflow over the device.
The electro-optical characteristics described in the following tables are valid only for use under the recommended operating conditions.
Data Sheet
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Technical Data Transmitter Electro-Optical Characteristics Parameter Output Power (Average)1) Center Wavelength Spectral Width (RMS) Extinction Ratio (Dynamic) Reset Threshold for VCCt Power on Delay Total Tx Jitter
2) 2)
Symbol min.
Limit Values typ. max. -3 1355 4 9 2.7 30 53 2 0.8 0.4 0.06 1 10 130 -9.5 1270
Unit dBm nm nm dB V ms ps V V ms s
PO
C ER
VTH tDEL
TJ
TDis Assert Voltage LVTTL TDis Deassert Voltage LVTTL TDis Assert Time3) TDis Deassert Time4)
1) 2) 3) 4)
VTDH VTDL tASS tDAS
Into single mode fiber, 9 m diameter Laser power is shut down if power supply is below VTH and switched on if power supply is above VTH after tRES. TDis assertion to laser shutdown. TDis reassertion to laser startup.
Receiver Electro-Optical Characteristics Parameter Sensitivity (Average Power)1) Saturation (Average Power) Min. Optical Modulation Amplitude2) Signal Detect Assert Level3) Signal Detect Deassert Level Signal Detect Hysteresis Signal Detect Assert Time Receiver 3 dB Cut off Frequency2)
3) 2), 4)
Symbol min.
Limit Values typ. max. -20 -3 15 -20 -37 3 0.1 0.35 1.5
Unit dBm dBm W dBm dBm dB ms ms GHz
PIN PSAT
OMA
PSDA PSDD PSDA
-PSDD
Signal Detect Deassert Time4)
tASS tDAS
Data Sheet
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Technical Data Receiver Electro-Optical Characteristics (cont'd) Parameter Receiver 10 dB Cut off Frequency2) Output Voltage5)
5)
Symbol min.
Limit Values typ. max. 3 -650 -1300 2000
Unit GHz mV mV mV mV mV V
VOH-VCC -1110 VOL-VCC -1800 Output Voltage Differential Data Output Voltage VODpk-pk 1000
Swing
5)
Signal Detect Output High Voltage LVPECL6), 7) Signal Detect Output Low Voltage LVPECL6), 7) Signal Detect Output High Voltage LVTTL6), 8) Signal Detect Output Low Voltage LVTTL6), 8) Rx-Monitor 9), 10)
1) 2) 3)
VSDH-VEE VCC
-1200
VCC
-820
VSDL-VEE VCC
-1900
VCC
-1580
VSDH VSDL
Rx-Mon
2.4 0.5 0.5 1
V A/W
4)
5) 6)
7) 8) 9) 10)
Minimum average optical power at which the BER is less than 1x10-10. Measured with a 27-1 NRZ PRBS. Fibre Channel PI Standard. An increase in optical power above the specified level will cause the Signal Detect to switch from a low state to a high state (high active output). A decrease in optical power below the specified level will cause the Signal Detect to switch from a high state to a low state. Load is 100 differential. Internal load is 510 to GND, no external load necessary. Signal Detect is a high active output. High level means signal is present, low level means loss of signal. For V23818-K15-L37/L36/L17/L16/L35. For V23818-K15-L47/L46/L57/L56/L45. Monitor current needs to be sunk to VCC. Only available on 2x10 transceivers: V23818-K15-L17/L16/L57/L56.
Data Sheet
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Eye Safety Eye Safety This laser based single mode transceiver is a Class 1 product. It complies with IEC 60825-1 and FDA 21 CFR 1040.10 and 1040.11. To meet laser safety requirements the transceiver shall be operated within the Absolute Maximum Ratings. Attention: All adjustments have been made at the factory prior to shipment of the devices. No maintenance or alteration to the device is required. Tampering with or modifying the performance of the device will result in voided product warranty. Note: Failure to adhere to the above restrictions could result in a modification that is considered an act of "manufacturing", and will require, under law, recertification of the modified product with the U.S. Food and Drug Administration (ref. 21 CFR 1040.10 (i)). Laser Data Wavelength Total output power (as defined by IEC: 7 mm aperture at 14 mm distance) Total output power (as defined by FDA: 7 mm aperture at 20 cm distance) Beam divergence 1300 nm < 2 mW < 180 W 6
FDA
Complies with 21 CFR 1040.10 and 1040.11
IEC
Class 1 Laser Product
File: 1401
Figure 11
Required Labels
Indication of laser aperture and beam
Tx Rx
20 19 18 17 16 15 14 13 12 11
Top view
1 2 3 4 5 6 7 8 9 10
File: 1334
Figure 12
Laser Emission
Data Sheet
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EMI-Recommendations EMI-Recommendations To avoid electromagnetic radiation exceeding the required limits please take note of the following recommendations. When Gigabit switching components are found on a PCB (multiplexers, clock recoveries etc.) any opening of the chassis may produce radiation also at chassis slots other than that of the device itself. Thus every mechanical opening or aperture should be as small as possible. On the board itself every data connection should be an impedance matched line (e.g. strip line, coplanar strip line). Data, Datanot should be routed symmetrically, vias should be avoided. A terminating resistor of 100 should be placed at the end of each matched line. An alternative termination can be provided with a 50 resistor at each (D, Dn). In DC coupled systems a thevenin equivalent 50 resistance can be achieved as follows: for 3.3 V: 125 to VCC and 82 to VEE, for 5 V: 82 to VCC and 125 to VEE at Data and Datanot. Please consider whether there is an internal termination inside an IC or a transceiver. In certain cases signal GND is the most harmful source of radiation. Connecting chassis GND and signal GND at the plate/bezel/chassis rear e.g. by means of a fiber optic transceiver may result in a large amount of radiation. Even a capacitive coupling between signal GND and chassis may be harmful if it is too close to an opening or an aperture. If a separation of signal GND and chassis GND is not planned, it is strongly recommended to provide a proper contact between signal GND and chassis GND at every location where possible. This concept is designed to avoid hotspots. Hotspots are places of highest radiation which could be generated if only a few connections between signal and chassis GND exist. Compensation currents would concentrate at these connections, causing radiation. By use of Gigabit switching components in a design, the return path of the RF current must also be considered. Thus a split GND plane of Tx and Rx portion may result in severe EMI problems. A recommendation is to connect the housing leads to signal GND. However, in certain applications it may improve EMI performance by connecting them to chassis GND. The cutout should be sized so that all contact springs make good contact with the face plate. Please consider that the PCB may behave like a waveguide. With an r of 4, the wavelength of the harmonics inside the PCB will be half of that in free space. In this scenario even the smallest PCBs may have unexpected resonances.
Data Sheet
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Recommended Termination Schemes Recommended Termination Schemes 2x10 DC/DC Transceiver
PMon+
20
19
17
BMon+ 18 VEEt TD+ Laser Driver 100 TD- TDis VCCt 15 13 11 12,16 14 C6 VCC SerDes VCC SerDat Out +
PMon-
BMon-
C8 TDis
C7
SerDat Out -
ECL/ PECL Driver
R4
SFF Transceiver VCCr 7
C1 L2 C3 C2 SD 8 1 PDBias SD C10 Serializer/ Deserializer
Signal Detect
PreAmp
Limiting Amplifier
RD-
RD-
9
C4 R1
R5 SerDat In - Receiver PLL etc. SerDat In +
L1
VCC 3.3 V
RD+
RD+
10 2,3,6
C9
C5
C1/2/3 = 4.7 ... 10 F C4/5/6/7 = 100 nF C8/9/10 = Design criterion is the resonance frequency only. The self resonant frequency of the capacitor must be in the vicinity of the nominal data rate. Short traces are mandatory. = 1 ... 4.7 H L1/2*) R1 = 100 (depending on SerDes chip used, ensure proper 50 termination to VEE or 100 differential is provided. Check for termination inside of SerDes chip). R2/3 = 150 R4/5 = Biasing (depends on SerDes chip). Place R1/4/5 close to SerDes chip. Place R2/3 close to Infineon transceiver.
*) The inductors may be replaced by appropriate Ferrite beads.
File: 1390
Figure 13
Data Sheet
19
R2
R3
VEEr
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Recommended Termination Schemes 2x10 AC/AC Transceiver
PMon+
BMon+
PMon-
BMon-
20
19
17
18 VEEt TD+ Laser Driver 100 TD- TDis VCCt 15 13 11 C1 VCCr 7 L2 C3 C2 SD 8 1 PDBias PreAmp Limiting Amplifier RD- 9 SD 12,16 14
VCC SerDes VCC SerDat Out + C4 TDis R5 R6 L1 VCC 3.3 V
SerDat Out -
ECL/ PECL Driver
SFF Transceiver
C6
Serializer/ Deserializer
Signal Detect
R1
R2 SerDat In -
RD+
10 2,3,6
C5 SerDat In +
Receiver PLL etc.
C1/2/3 C4/5/6
= 4.7 ... 10 F = Design criterion is the resonance frequency only. The self resonant frequency of the capacitor must be in the vicinity of the nominal data rate. Short traces are mandatory. = 1 ... 4.7 H L1/2*) R1/2/3/4 = Depends on SerDes chip used, ensure proper 50 termination to VEE or 100 differential is provided. Check for termination inside of SerDes chip. R5/6 = Biasing (depends on SerDes chip). Place R1/2/3/4/5/6 close to SerDes chip.
*) The inductors may be replaced by appropriate Ferrite beads.
File: 1391
Figure 14
Data Sheet
20
R3
R4
VEEt
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Recommended Termination Schemes 2x5 DC/DC Transceiver
VEEt TD+ Laser Driver 100 TD- TDis VCCt
7 9 C6
VCC SerDes VCC SerDat Out +
10 C8 8 6 C1 TDis
C7
SerDat Out -
ECL/ PECL Driver
R4
SFF Transceiver VCCr 2
R5
L1
VCC 3.3 V
L2 C3 C2 C10
Serializer/ Deserializer
Signal Detect
SD
3
SD
PreAmp
Limiting Amplifier
RD-
RD-
4
C4 R1
SerDat In - Receiver PLL etc.
RD+
RD+
5
C9
C5
SerDat In +
C1/2/3 = 4.7 ... 10 F C4/5/6/7 = 100 nF C8/9/10 = Design criterion is the resonance frequency only. The self resonant frequency of the capacitor must be in the vicinity of the nominal data rate. Short traces are mandatory. = 1 ... 4.7 H L1/2*) R1 = 100 (depending on SerDes chip used, ensure proper 50 termination to VEE or 100 differential is provided. Check for termination inside of SerDes chip). R2/3 = 150 R4/5 = Biasing for outputs depending on Serializer. Place R1/4/5 close to SerDes chip. Place R2/3 close to Infineon transceiver.
*) The inductors may be replaced by appropriate Ferrite beads.
File: 1392
Figure 15
Data Sheet
R2
21
R3
VEEr
1
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Recommended Termination Schemes 2x5 AC/AC Transceiver
VCC SerDes VEEt TD+ Laser Driver 100 TD- TDis VCCt 7 9 VCC SerDat Out +
10 C4 8 6 C1 TDis R5 R6 L1 VCC 3.3 V
SerDat Out -
ECL/ PECL Driver
SFF Transceiver VCCr 2
L2 C3 C2 C6
Serializer/ Deserializer
Signal Detect
SD
3
SD R1 R2 SerDat In - C5 SerDat In + Receiver PLL etc. R4
PreAmp
Limiting Amplifier
RD-
RD-
4
RD+
RD+
5
VEEr
1 R3
= 4.7 ... 10 F = Design criterion is the resonance frequency only. The self resonant frequency of the capacitor must be in the vicinity of the nominal data rate. Short traces are mandatory. = 1 ... 4.7 H L1/2*) R1/2/3/4 = Depends on SerDes chip used, ensure proper 50 termination to VEE or 100 differential is provided. Check for termination inside of SerDes chip. = Biasing (depends on SerDes chip). R5/6 Place R1/2/3/4/5/6 close to SerDes chip.
*) The inductors may be replaced by appropriate Ferrite beads.
File: 1393
C1/2/3 C4/5/6
Figure 16
Data Sheet
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Package Outlines Package Outlines
a) recommended bezel position
Drawing shown is 2x10 pinning with collar
Dimensions in mm [inches]
File: 1213
Figure 17
Data Sheet
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V23818-K15-Lxx Revision History: Previous Version: Page 15 2003-03-21 2003-03-05 DS2
Subjects (major changes since last revision) Table "Transmitter Electro-Optical Characteristics" changed
For questions on technology, delivery and prices please contact the Infineon Technologies Offices in Germany or the Infineon Technologies Companies and Representatives worldwide: see our webpage at http://www.infineon.com.
Edition 2003-03-21 Published by Infineon Technologies AG, St.-Martin-Strasse 53, D-81541 Munchen, Germany
(c) Infineon Technologies AG 2003.
All Rights Reserved. Attention please! The information herein is given to describe certain components and shall not be considered as warranted characteristics. Terms of delivery and rights to technical change reserved. We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding circuits, descriptions and charts stated herein. Infineon Technologies is an approved CECC manufacturer. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office in Germany or our Infineon Technologies Representatives worldwide. Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life-support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered.

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